7nm
Taiwan Semiconductor Manufacturing Co. this week said its revenue for the second quarter 2024 reached $20.82 billion, making it the company's best quarter (at least in dollars) to date. TSMC's high-performance computing (HPC) platform revenue share exceeded 52% for the first time in many years due to demand for AI processors and rebound of the PC market. TSMC earned $20.82 billion USD in revenue for the second quarter of 2024, a 32.8% year-over-year increase and a 10.3% increase from the previous quarter. Perhaps more remarkable, $20.82 billion is a higher result than the company posted Q3 2022 ($20.23 billion), the foundry's best quarter to date. Otherwise, in terms of profitability, TSMC booked $7.59 billion in net income for the quarter, for a gross margin of...
An Interview with AMD’s CTO Mark Papermaster: ‘There’s More Room At The Top’
On the back of a very busy 2019, AMD is gaining market share and is now a performance leader in a lot of CPU segments. The company has executed...
68 by Dr. Ian Cutress on 12/30/2019
AnandTech Year In Review 2019: Lots of CPUs
Throughout 2019, we’ve had quite the reverse of performance when it comes to the competitiveness of the modern performance-oriented desktop processor. This year we’ve seen AMD introduce its Zen...
25 by Dr. Ian Cutress on 12/27/2019
Intel Hires Fab Veteran, Former GlobalFoundries CTO Dr. Gary Patton
Intel has hired Dr. Gary Patton, the former CTO at GlobalFoundries and an ex-head of IBM Microelectronics business. Dr Patton was leading Global Foundries leading edge processes before that...
21 by Anton Shilov on 12/11/2019
Intel’s Manufacturing Roadmap from 2019 to 2029: Back Porting, 7nm, 5nm, 3nm, 2nm, and 1.4 nm
One of the interesting disclosures here at the IEEE International Electron Devices Meeting (IEDM) has been around new and upcoming process node technologies. Almost every session so far this...
138 by Dr. Ian Cutress on 12/11/2019
Qualcomm Windows on Snapdragon: New 7c & 8c SoCs for sub-$800 Laptops
Last year Qualcomm introduced its flagship Snapdragon 8cx platform for premium always-connected PCs (ACPCs) that packed the best technologies that the company had to offer at the time. Being...
54 by Anton Shilov on 12/6/2019
Qualcomm Announces Snapdragon 865 and 765(G): 5G For All in 2020, All The Details
We’re here in Maui for the second day of Qualcomm’s fourth annual Snapdragon summit, for what is probably the most exciting part of the event, as we cover the...
91 by Andrei Frumusanu on 12/4/2019
The AMD Ryzen Threadripper 3960X and 3970X Review: 24 and 32 Cores on 7nm
One of the constant themes of 2019 has been to ask AMD employees about the future of its Threadripper line of products. Since the start of the year we’ve...
245 by Dr. Ian Cutress, Andrei Frumusanu & Gavin Bonshor on 11/25/2019
AnandTech Exclusive: An Interview with Intel’s Raja Koduri about Xe
This week Raja gave the keynote at Intel’s HPC DevCon event, a precursor to Supercomputing, and I did my usual thing of asking for the interview, fully expecting the...
73 by Dr. Ian Cutress on 11/20/2019
Intel’s Xe for HPC: Ponte Vecchio with Chiplets, EMIB, and Foveros on 7nm, Coming 2021
Today is Intel’s pre-SC19 HPC Devcon event, and with Raja Koduri on stage, the company has given a small glimpse into its high-performance compute accelerator strategy for 2021. Intel...
16 by Dr. Ian Cutress on 11/17/2019
The AMD Ryzen 9 3950X Review: 16 Cores on 7nm with PCIe 4.0
Deciding between building a mainstream PC and a high-end desktop has historically been very clear cut: if budget is a concern, and you're interested in gaming, then typically a...
206 by Dr. Ian Cutress on 11/14/2019
AMD Q4: 16-core Ryzen 9 3950X, Threadripper Up To 32-Core 3970X, Coming November 25th
AMD is set to close out the year on a high note. As promised, the company will be delivering its latest 16-core Ryzen 9 3950X processor, built with two...
171 by Dr. Ian Cutress on 11/7/2019
New Tools Simplify Development of 2.5D Multi-Die 7nm Designs at Samsung Foundry
Advanced packaging technologies simplify production and increase performance of highly-complex multi-die SoCs as the semiconductor industry is looking at chiplet approach as an alternative to large dies that take...
5 by Anton Shilov on 10/22/2019
AMD May Be Prepping More 280 W EPYC Enterprise CPUs
Back in September, AMD announced its 64-core EPYC 7H12 processor - a 280 W TDP behemoth with an increased base frequency designed specifically for the high-performance computing market. Based...
22 by Anton Shilov on 10/21/2019
TSMC Radically Boosts CapEx to Expand Production Capacities, To Reach $14B For 2019
Forecasting strong demand for its 5 nm and 7 nm class process technologies in the coming years, TSMC has announced that it's increasing its capital expenditure for 2019 by...
18 by Anton Shilov on 10/18/2019
EUV Demand is Up: EUV Device Manufacturer ASML Beats Sales Estimates
Between the smartphone revolution, cloud computing, and the Internet of Things, the demand for cutting-edge chips has never been higher. And if you have any doubts about that, then...
46 by Anton Shilov on 10/16/2019
Samsung & TSMC Develop 8nm & 7nm Automotive-Grade Nodes
As vehicles are getting ‘smarter’ and gaining autopilot capabilities, it is easy to predict that the demand for higher-performing and more complex automotive SoCs will be growing rapidly in...
29 by Anton Shilov on 10/14/2019
TRX40 Chipset For Upcoming AMD Ryzen Threadripper Listed
In what is being put down to an inadvertent leak by MSI, it could be that the currently unannounced chipset for AMD's new 3rd Gen Ryzen Threadripper series processors...
21 by Gavin Bonshor on 10/10/2019
TSMC: N7+ EUV Process Technology in High Volume, 6nm (N6) Coming Soon
TSMC announced on Monday that its customers have started shipping products based on chips made by TSMC using its N7+ (2nd Generation 7 nm with EUV) process technology that...
27 by Anton Shilov on 10/8/2019
Arm & TSMC Showcase 7nm Chiplet, Eight A72 at 4GHz on CoWoS Interposer
Arm and TSMC this week unveiled their jointly developed proof-of-concept chip that combines two quad-core Cortex-72-based 7 nm chiplets on TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) interposer. The two chips are connected...
26 by Anton Shilov on 9/27/2019
AMD’s New 280W 64-Core Rome CPU: The EPYC 7H12
If there’s something that gets everyone excited, it is more performance. On the Enterprise side, AMD has made big strides with its latest EPYC processor stack, featuring up to...
54 by Dr. Ian Cutress on 9/18/2019
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